半導体集積回路装置、信号処理装置、及び半導体モジュール

Title:

半導体集積回路装置、信号処理装置、及び半導体モジュール

Document Type and Number:

Japanese Patent JP5283639

Kind Code:

B2

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Inventors:

Hiroaki Inoue

Application Number:

JP2010014435A

Publication Date:

September 04, 2013

Filing Date:

January 26, 2010

Export Citation:

Assignee:

LAPIS Semiconductor Co., Ltd.

International Classes:

H01L21/822; H01L27/04; H04B1/10

Domestic Patent References:

Attorney, Agent or Firm:

Minoru Maeda
Youichi Yamagata
Masahiko Shinohara

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