Title:
段ボールシートの糊付方法及び装置
Document Type and Number:
Japanese Patent JP5297721
Kind Code:
B2
Abstract:
In a gluing method of a box production line using a glue gun of a contact-type, the glue can be applied firmly without placing excessive pressure on a gluing margin during a gluing step even when a paper type of the corrugated board sheet changes due to an order change. The gluing method of applying glue to a gluing area in a gluing margin of a joint flap of the corrugated board sheet (S) traveling on a box production line by a glue gun of a contact-type in a gluing process, the method comprising the steps of: applying pressure (P 1 ) on the glue gun (12) by a first pressure device (15) in a direction that compensates self-weight of the glue gun (12) on the corrugated board sheet (S) during the gluing process; detecting a reaction force of the gluing margin (f) by a reaction-force sensor (36) which is arranged in a transfer line (PL) of the corrugated board sheet (S) on an upstream side of the glue gun in a traveling direction of the corrugated board sheet; and applying pressure (P 2 ) on the gluing margin (f) of the corrugated board sheet (S) by a second pressure device (21) arranged in a proximity of a gluing point at which the glue is applied by the glue gun during the gluing process, the pressure to be applied by the second pressure device being set in accordance with a detection value of the reaction-force sensor.
Inventors:
Osamu Hatano
Kazuya Sugimoto
Kazuya Sugimoto
Application Number:
JP2008218075A
Publication Date:
September 25, 2013
Filing Date:
August 27, 2008
Export Citation:
Assignee:
Mitsubishi Heavy Industries Printing Paper Machinery Co., Ltd.
International Classes:
B31B50/62
Domestic Patent References:
JP2003154583A | ||||
JP2001030380A | ||||
JP2000334351A | ||||
JP10211664A | ||||
JP3133719A |
Foreign References:
US20060081727 |
Attorney, Agent or Firm:
Yu Sanada
Patent business corporation Takahashi Matsumoto & Partners
Patent business corporation Takahashi Matsumoto & Partners