To solve a problem that in the case that a wire antenna is directly joined to a connecting bump of a semiconductor chip in a RFID (Radio Frequency Identification) tag inlet, when the wire is pressed on and joined to the connecting bump, the wire is easy to be deviated from an electrode bump location since a metal of the wire antenna has a cylindrical shape.
The manufacturing method of the RFID tag inlet using the wire antenna is characterized by having at least: a process to form a parallel flat plane part at an end of the wire antenna joined with the connecting bump formed on the semiconductor chip; and a process to join the connecting bump and the wire antenna after making a flat plane of the parallel flat plane part contact with the connecting bump of the semiconductor chip.
COPYRIGHT: (C)2010,JPO&INPIT
Shigeki Minemura
Takamitsu Nakabayashi
Tomonori Adachi
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