Title:
配線基板及び半導体装置及び配線基板の製造方法
Document Type and Number:
Japanese Patent JP5306634
Kind Code:
B2
Abstract:
The present disclosure relates to a method of manufacturing a wiring board. The method includes: (a) preparing a first board having a pad; (b) providing an insulating member on the first board, wherein a size of the insulating member is larger than that of the first board, when viewed from the top; (c) forming a via in the insulating member such that the via is directly connected to the pad; and (d) repeatedly forming a wiring layer and an insulating layer on the insulating member in which the via is formed, thereby forming a second board.
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Inventors:
Masato Tanaka
Fumihiko Hayano
Tohru Hizume
Fumihiko Hayano
Tohru Hizume
Application Number:
JP2007302994A
Publication Date:
October 02, 2013
Filing Date:
November 22, 2007
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2007012848A | ||||
| JP2004228393A | ||||
| JP2006339277A | ||||
| JP2009088177A | ||||
| JP2004281830A | ||||
| JP2002124593A |
Foreign References:
| WO2007129545A1 |
Attorney, Agent or Firm:
Tadahiko Ito