Title:
多層配線基板及びその製造方法
Document Type and Number:
Japanese Patent JP5306789
Kind Code:
B2
Abstract:
A multilayer wiring substrate is manufactured through a recess forming step, a gold-diffusion-prevention-layer forming step, a terminal forming step, resin-insulating-layer forming step, a conductor forming step, and a metal-layer removing step. In the recess forming step, a copper foil layer is half-etched so as to form recesses. In the gold-diffusion-prevention-layer forming step, a gold diffusion prevention layer is formed in each recess. In the terminal forming step, a gold layer, a nickel layer, and a copper layer are stacked in sequence on the gold diffusion prevention layer to thereby form a surface connection terminal. In the resin-insulating-layer forming step, a resin insulating layer is formed, and, in the conductor forming step, via conductors and conductor layers are formed. In the metal-layer removing step, the copper foil layer and the gold diffusion prevention layer are removed so that the gold layer projects from the main face of the laminated structure.
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Inventors:
Takuya Hanto
Application Number:
JP2008308445A
Publication Date:
October 02, 2013
Filing Date:
December 03, 2008
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K3/46; H01L21/60; H01L23/12; H01L23/32; H05K3/34
Domestic Patent References:
| JP2005175510A | ||||
| JP2008251702A | ||||
| JP2007165513A | ||||
| JP2008300507A | ||||
| JP2007123883A |
Attorney, Agent or Firm:
Hisahiko Atsumi