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Patent Searching and Data


Title:
チップ型電子部品
Document Type and Number:
Japanese Patent JP5308494
Kind Code:
B2
Inventors:
山崎 洋一
Application Number:
JP2011198005A
Publication Date:
October 09, 2013
Filing Date:
September 12, 2011
Export Citation:
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Assignee:
京セラ株式会社
International Classes:
H01G4/12; H01C1/02; H01C7/18; H01G2/10; H01G4/008; H01G4/232; H01G4/30
Domestic Patent References:
JP2002373825A
JP2003347146A
JP2003264119A
JP9260195A
JP9260192A
JP2004289086A
JP9260206A
JP9260193A
JP11340073A
Attorney, Agent or Firm:
深井 敏和