Title:
樹脂組成物および熱収縮性フィルム
Document Type and Number:
Japanese Patent JP5328069
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition useful for a raw material of a heat- shrinkable film excellent in heat-shrinkable properties, natural-shrinking resistance and rigidity, and to provide a film using the same. SOLUTION: The resin composition comprises a component A, a component B and a component C as main components. The component A is a copolymer composition comprising or mainly comprising a block copolymer consisting of a vinyl aromatic hydrocarbon and a conjugated diene and having a block mainly comprising the vinyl aromatic hydrocarbon and a block mainly comprising the conjugated diene, in which the relation of the loss tangent value obtained by dynamic viscoelasticity measurements to temperature satisfies specific conditions. The component B is a styrenic copolymer different from the component A consisting of a vinyl aromatic hydrocarbon and a conjugated diene, in which the loss tangent value obtained by dynamic viscoelasticity measurements has a maximum value within the range of from 65 deg.C to below 100 deg.C. The component C is styrenic resin different from the component A and the component B.
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Inventors:
Eiji Sato
Hideki Totani
Kinya Kurokawa
Hideki Totani
Kinya Kurokawa
Application Number:
JP2001296558A
Publication Date:
October 30, 2013
Filing Date:
September 27, 2001
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
C08J5/18; C08L53/02; B29C61/06; C08L25/04; C08L25/08; B29K55/00; B29K105/02; B29L7/00
Domestic Patent References:
JP1058540A | ||||
JP797419A | ||||
JP1045858A | ||||
JP11158241A | ||||
JP6097827A | ||||
JP6099116A | ||||
JP3766820B2 | ||||
JP2008274299A |