Title:
ヒートパイプおよび電子機器
Document Type and Number:
Japanese Patent JP5334288
Kind Code:
B2
Abstract:
The Present Invention provides a heat pipe and an electronic device which can efficiently cool a light emitting element arranged in an end portion, so that it is possible to efficiently mount the heat pipe in a narrow space. The heat pipe is provided with an upper plate (3), a lower plate (4) opposing the upper plate (3), one intermediate plate or a plurality of intermediate plates (5) laminated between the upper plate (3) and the lower plate (4), a main body portion (2) formed by lamination of the upper plate (3), the lower plate (4) and the intermediate plate (5) and capable of sealing a cooling medium, a vapor diffusion path (6) capable of diffusing a vaporized cooling medium, and a capillary flow path (7) capable of reflowing a condensed cooling medium, and the vapor diffusion path (6) is formed from a first end portion (15) of the main body portion toward a second end portion (16) opposing the first end portion (15).
Inventors:
Mizuta Kei
Katsuya Tsuruta
Fukunaga Noriyasu
Toshiaki Kotani
Katsuya Tsuruta
Fukunaga Noriyasu
Toshiaki Kotani
Application Number:
JP2008228616A
Publication Date:
November 06, 2013
Filing Date:
September 05, 2008
Export Citation:
Assignee:
Japan Molex Co., Ltd.
National University Corporation Kagoshima University
National University Corporation Kagoshima University
International Classes:
H01L23/427; F28D15/02
Domestic Patent References:
| JP2007315745A | ||||
| JP2004060911A | ||||
| JP2008118357A |
Attorney, Agent or Firm:
Mizoguchi
Kazuyuki Hirano
Mizoguchi
Kazuyuki Hirano
Mizoguchi