Title:
コンタクト装置及び回路パッケージ
Document Type and Number:
Japanese Patent JP5351063
Kind Code:
B2
Abstract:
A contact device including a contact array, in which contacts are arranged in a grid, and a plurality of differential wire pairs electrically connected to the contact array, wherein each differential wire pair is connected to a contact pair formed by two adjacent contacts in the contact array, and each contact pair is arranged such that a direction of a straight line connecting the two contacts therein is different from a direction of a straight line connecting the two contacts in a contact pair adjacent thereto.
Inventors:
Takashi Kusaka
Application Number:
JP2010005335A
Publication Date:
November 27, 2013
Filing Date:
January 13, 2010
Export Citation:
Assignee:
Advantest Corporation
International Classes:
H01L23/12
Domestic Patent References:
| JP2011018673A | ||||
| JP2005056960A | ||||
| JP5041463A | ||||
| JP4346255A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation