To provide a layered capacitor and a packaging structure of the layered capacitor which can suppress an outbreak of sound squeaking while allowing SMD packaging.
In the packaging structure K1 of the layered capacitor 1, lead terminals 7 and 7 are fixed to terminal electrodes 5 and 5 covering both ends 4a and 4b of an element body 4. Thus, even when electrostrictive strain vibrations occur in the layered capacitor 1 upon voltage application, the electrostrictive strain vibrations are relieved because of deflections of the lead terminals 7 and 7, thereby preventing an outbreak of sound squeaking. Further, as a forefront part 7b of the lead terminal 7 protrudes from a second face 6b serving as a packaging face of an insulating substrate 6, it is possible to simply make connection with a land electrode 2a of a packaging substrate 2 in the SMD packaging. As the forefront part 7b of the lead terminal 7 passes through a through hole 9 in a state not being fixed to the insulating substrate 6, fixing to the insulating substrate 6 does not impede the deflection of the lead terminal 7, and a relief effect of the electrostrictive strain vibration is secured.
COPYRIGHT: (C)2010,JPO&INPIT
| JP3290987A | ||||
| JP2003068563A | ||||
| JP57026836U | ||||
| JP9148173A | ||||
| JP2001035751A | ||||
| JP7033025U | ||||
| JP5299893A | ||||
| JP2090522U | ||||
| JP6104031A |
| WO2003084296A1 |
Yoshiki Kuroki
Takashi Mikami
Yasunori Ishizaka