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Patent Searching and Data


Title:
分断装置
Document Type and Number:
Japanese Patent JP5353978
Kind Code:
B2
Inventors:
Hitoshi Nishio
Katsuki Nakata
Application Number:
JP2011192359A
Publication Date:
November 27, 2013
Filing Date:
September 05, 2011
Export Citation:
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Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/03; B28D5/00; H01L21/301
Domestic Patent References:
JP2001261357A
JP2006245263A
Foreign References:
WO2005053925A1
WO2006070825A1
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita



 
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