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Title:
複数領域処理システム及びヘッド
Document Type and Number:
Japanese Patent JP5357159
Kind Code:
B2
Abstract:
The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.

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Inventors:
End, Rick
Winer cart
De, Intranil
Tun, james
Chao, Mao Shen
Application Number:
JP2010524156A
Publication Date:
December 04, 2013
Filing Date:
September 05, 2008
Export Citation:
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Assignee:
INTERMOLECULAR,INC.
International Classes:
C23C16/04; C23C16/455
Domestic Patent References:
JP2006140439A
JP11050237A
JP2006310813A
JP2004152702A
JP7047201A
JP7201752A
Foreign References:
WO2002061172A1
WO2007061633A1
Attorney, Agent or Firm:
Mieko Kashihara
Goichi Takahashi
Masahito Shibata



 
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