Title:
導電回路形成用導電性樹脂組成物及び導電回路
Document Type and Number:
Japanese Patent JP5358732
Kind Code:
B1
Abstract:
This invention provides a conductive resin composition suitable for a thermally intolerant substrate, ensuring the excellent conductivity and resolution, and therefore having the excellence in any one of the coating strength and sealability with a base substrate, and a conductive loop formed by using the conductive resin composition. This invention provides a conductive resin composition, comprising: a carboxyl-containing resin, a conductive powder, a multifunctional(meth) acrylic acid monomer, a photoinitiator and a blocked isocyanate compound.
Inventors:
Takahiro Yoshida
Aoyama Yoshitomo
Aoyama Yoshitomo
Application Number:
JP2012252617A
Publication Date:
December 04, 2013
Filing Date:
November 16, 2012
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
G03F7/004; G03F7/027; G03F7/031; G03F7/033; H01B1/20; H01B13/00
Domestic Patent References:
JP2009192827A | ||||
JP2007264270A | ||||
JP2005274865A |
Foreign References:
WO2010113287A1 | ||||
WO2007007802A1 |
Attorney, Agent or Firm:
Kurata Masatoshi
Yoshihiro Fukuhara
Makoto Nakamura
Nobuhisa Nogawa
Toshio Shirane
Takashi Mine
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Takao Ako
Tadashi Inoue
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Yoshihiro Fukuhara
Makoto Nakamura
Nobuhisa Nogawa
Toshio Shirane
Takashi Mine
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Takao Ako
Tadashi Inoue
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori