Title:
部品組立体
Document Type and Number:
Japanese Patent JP5359000
Kind Code:
B2
More Like This:
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Inventors:
Yutaka Yamashita
Bunri Koyama
Bunri Koyama
Application Number:
JP2008086302A
Publication Date:
December 04, 2013
Filing Date:
March 28, 2008
Export Citation:
Assignee:
Advics Co., Ltd.
International Classes:
B21D39/00; B60T8/34; B60T15/36; F04B53/00; F04B53/10; F16B4/00; F16K15/04; F16K27/00; F16K31/06; F16K51/00
Domestic Patent References:
| JP2000046221A | ||||
| JP2003020856A | ||||
| JP2001353539A | ||||
| JP2003314719A | ||||
| JP9060756A | ||||
| JP7047942A |
Attorney, Agent or Firm:
Bunji Kamada
Torii Kazuhisa
Takayoshi Tagawa
Higashio Masahiro
Torii Kazuhisa
Takayoshi Tagawa
Higashio Masahiro