基材の処理方法、積層体および半導体装置

Title:

基材の処理方法、積層体および半導体装置

Document Type and Number:

Japanese Patent JP5360260

Kind Code:

B2

Abstract:

A method that includes, in the sequence set forth, (1) temporarily fixing a substrate onto a support via a temporary fixing material including a central section (A) having two or more layers and a peripheral section (B) with solvent resistance, section (B) being in contact with a peripheral portion of the support on the substrate side and with a peripheral portion of the substrate on the support side, section (A) being in contact with a central portion of the support on the substrate side and with a central portion of the substrate on the support side, the temporary fixing thus resulting in a stack in which section (A) is covered with the support, section (B) and the substrate; (2) processing the substrate and/or transporting the stack; (3) dissolving section (B) with a solvent; and (4) heating the residue of the temporary fixing material and separating the substrate from the support.

More Like This:

JP3031904	COMPOUND MEMBER, ITS SEPARATING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE USING THE METHOD
WO/2020/226702	THREE-DIMENSIONAL MEMORY DEVICE USING EPITAXIAL SEMICONDUCTOR CHANNELS AND A BURIED SOURCE LINE AND METHOD OF MAKING THE SAME
JP2003282728	SEMICONDUCTOR ELEMENT AND ITS MANUFACTURING METHOD

Inventors:

Seiichiro Takahashi
Hirofumi Goto

Application Number:

JP2012106681A

Publication Date:

December 04, 2013

Filing Date:

May 08, 2012

Export Citation:

Click for automatic bibliography generation Help

Assignee:

JSR CORPORATION

International Classes:

H01L21/02; H01L21/301; H01L21/304

Domestic Patent References:

JP2010506406A

Foreign References:

US20090218560

Attorney, Agent or Firm:

Patent corporation ssinpat

Previous Patent: JPS5360259

Next Patent: LIGHT SOURCE DIRECTION FINDER