Title:
表面処理銅箔及びそれを用いた積層板
Document Type and Number:
Japanese Patent JP5362921
Kind Code:
B1
Abstract:
A surface treated copper foil which is well bonded to a resin and allows the resin to have excellent transparency after removal of the copper foil by etching, and a laminate using the same are provided. A surface treated copper foil having at least one surface with a skewness Rsk of −0.35 to 0.53, comprising an Sv defined by the following expression (1) of 3.5 or more based on a brightness curve: Sv=(ΔB×0.1)/(t1−t2) (1); wherein the brightness curve is obtained from an observation spot versus brightness graph, and the difference between the top average Bt and the bottom average Bb in the brightness curve extending from an edge of the mark to a portion without the mark is represented by ΔB (ΔB=Bt−Bb); and wherein t1 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1ΔB in the range from the intersections of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference.
Inventors:
Eita Arai
Atsushi Miki
Yasuo Arai
Nakamuro Kaichiro
Atsushi Miki
Yasuo Arai
Nakamuro Kaichiro
Application Number:
JP2013000676A
Publication Date:
December 11, 2013
Filing Date:
January 07, 2013
Export Citation:
Assignee:
jx Nippon Mining & Metals Co., Ltd.
International Classes:
C25D1/04; B21B1/40; B21B3/00; C25D7/06; H05K1/09
Domestic Patent References:
| JPH0987889A | 1997-03-31 | |||
| JP2012212529A | 2012-11-01 | |||
| JP2012211351A | 2012-11-01 | |||
| JP2011240625A | 2011-12-01 | |||
| JP2012224941A | 2012-11-15 | |||
| JPH0987889A | 1997-03-31 |
Foreign References:
| WO2012133564A1 | 2012-10-04 | |||
| WO2012133565A1 | 2012-10-04 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation