半田メッキ線の製造方法及び製造装置

Japanese Patent JP5367752

B2

A process and apparatus for producing a solder-plated wire are provided with which it is possible to stably obtain a plated wire of desired quality including sufficiently lowered 0.2% proof stress and to thereby improve product yield and production efficiency. The apparatus (10) is configured of: a plating pretreatment means (2) in which a copper wire (1a) is pretreated in preparation for plating; a plating means (61) in which the surface of the copper wire (1a) is plated with a solder; and a winding means (71) for winding the copper wire (1a, 1b) having the plated surface. The plating pretreatment means (2) includes a softening/annealing means (51) in which the copper wire (1a) is softened by annealing to reduce the proof stress. The copper wire (1a, 1b) having the lowered proof stress is wound by the winding means (71) at winding force lower than the proof stress of the copper wire (1a, 1b). The softening/annealing means (51), plating means (61), and winding means (71) have been arranged in series in this order from the upstream side along the running direction of the copper wire (1a, 1b).

Wakana Katsutoshi
Uemura Takatoshi
Takayuki Masui
Satoshi Tomimatsu
Fujima Katsuyoshi
Tsukano Shun
Takamasa Hayashi

JP2011078949A

December 11, 2013

March 31, 2011

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THE FURUKAW ELECTRIC CO.,LTD.
Riken Cable Co., Ltd.

C23C2/38; B21C47/00; C23C2/02; C23C2/08; C23C2/10; H01B13/00

JP4293757A
JP51014138A
JP2006144104A
JP2008168339A
JP5005169A
JP2185958A
JP11302811A
JP8199325A
JP2008169461A
JP2009016593A
JP5315502A
JP5255673B2
JP5255668B2

石田徳和,“極軟質型インターコネクタの開発”,三菱電線工業時報,日本,三菱電線工業(株),2009年10月31日,第106号,p.13-16

Yoshiaki Nagata
Motoaki Nagata
Eiji Ota

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