Title:
配線基板
Document Type and Number:
Japanese Patent JP5370883
Kind Code:
B2
Inventors:
Seiichi Abe
Application Number:
JP2008141918A
Publication Date:
December 18, 2013
Filing Date:
May 30, 2008
Export Citation:
Assignee:
Kyocera slc Technology Co., Ltd.
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2003258142A | ||||
| JP2001320208A |
Foreign References:
| US20040037516 |