Title:
貼合わせ基板の位置ズレ検出装置およびそれを用いる半導体製造装置ならびに貼合わせ基板の位置ズレ検出方法
Document Type and Number:
Japanese Patent JP5373707
Kind Code:
B2
Inventors:
Akamatsu Masaru
Kunio Range
Kunio Range
Application Number:
JP2010141464A
Publication Date:
December 18, 2013
Filing Date:
June 22, 2010
Export Citation:
Assignee:
Kobelco Kaken Co., Ltd.
International Classes:
G01B11/24; H01L21/66
Domestic Patent References:
| JP2002050749A | ||||
| JP6213620A |
Foreign References:
| WO2008018537A1 |
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Satoshi Sakurai
Masataka Otani
Satoshi Sakurai