Title:
めっき処理装置及びめっき処理方法並びにめっき処理プログラムを記録した記録媒体
Document Type and Number:
Japanese Patent JP5379773
Kind Code:
B2
Abstract:
A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2. The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25, the plating liquid supply units 29 and 30, the plating liquid drain unit 31. While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.
Inventors:
Takashi Tanaka
Yusuke Saito
Mitsuaki Iwashita
Takayuki Toshima
Yusuke Saito
Mitsuaki Iwashita
Takayuki Toshima
Application Number:
JP2010240543A
Publication Date:
December 25, 2013
Filing Date:
October 27, 2010
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C18/31
Domestic Patent References:
| JP7122523A | ||||
| JP2000064087A | ||||
| JP2004339579A | ||||
| JP2004200273A | ||||
| JP2004149824A | ||||
| JP2002129344A | ||||
| JP2002026491A | ||||
| JP2003124214A | ||||
| JP2005005279A |
Attorney, Agent or Firm:
Mihiro Uchino