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Patent Searching and Data


Title:
半導体装置
Document Type and Number:
Japanese Patent JP5388632
Kind Code:
B2
Inventors:
小山 潤
棚田 好文
宍戸 英明
Application Number:
JP2009050844A
Publication Date:
January 15, 2014
Filing Date:
March 04, 2009
Export Citation:
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Assignee:
株式会社半導体エネルギー研究所
International Classes:
H01L21/822; H01L27/04; H01L27/06; H01L27/08; H01L29/786; H02H1/04; H02H11/00
Domestic Patent References:
JP2002313949A
JP2003303890A
JP2005093496A
JP7321628A
JP2005129909A
JP20075774A
JP2006108307A
JP1289381A