Title:
シリコンウェハを分離させるための方法および装置
Document Type and Number:
Japanese Patent JP5388862
Kind Code:
B2
Abstract:
The invention relates to a method for separation of a silicon wafer ( 12 a) from a vertical stack ( 10 ) of silicon wafers ( 12 ). The method is characterised in that it comprises attaching a movable transport device ( 2 ) to a surface of the silicon wafer ( 12 a) in the stack ( 10 ), and horizontal movement of the silicon wafer ( 12 a) parallel (A) to the surface of the silicon wafer ( 12 a) until the silicon wafer ( 12 a) is separated from the stack ( 10 ). The invention also comprises a device for implementing the method.
Inventors:
Per Arne One
Arne Ramsland
Ole Christian Tronrud
Erik Yelters
Bent Hamel
Andre Schihe
Ola Tronrud
Arne Ramsland
Ole Christian Tronrud
Erik Yelters
Bent Hamel
Andre Schihe
Ola Tronrud
Application Number:
JP2009542686A
Publication Date:
January 15, 2014
Filing Date:
December 19, 2007
Export Citation:
Assignee:
RCC Wafer PTE Limited
International Classes:
H01L21/677; H01L21/304
Domestic Patent References:
| JP2000156396A | ||||
| JP10059544A | ||||
| JP9326375A | ||||
| JP2002075922A | ||||
| JP2009509891A | ||||
| JP2003512196A | ||||
| JP2009515349A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro