Title:
電解銅箔、該電解銅箔を使用した配線板及びフレキシブル配線板
Document Type and Number:
Japanese Patent JP5391366
Kind Code:
B2
Abstract:
The present invention provides an electrodeposited copper foil for a flexible wiring board, wherein handling in manufacturing and processing lines is easy, good bending and flexing are provided with heating during a film adhesion step, small electric devices can be accommodated, excessive coarsening of a crystal grain structure is minimized, and excellent fine pattern characteristics are provided. The electrodeposited copper foil of the present invention having excellent bending and flexing characteristics is such that a crystal distribution before heating (unprocessed) is such that a number of crystal grains less than 2 μm in diameter within a range of 300 μm×300 μm is 10,000 or greater and 25,000 or less, and a crystal distribution after heating for 1 hr at 300° C. is such that the number of crystal grains less than 2 μm in diameter within a range of 300 μm×300 μm is 5,000 or greater and 15,000 or less. The electrodeposited copper foil of the present invention is characterized in that a crystal orientation ratio (%) as measured by EBSD before heating (unprocessed) to that after heating for 1 hr at 300° C. is such that ratios of change after heating relative to before heating for the following totals: a total of the (001) plane and the (311) plane, a total of the (011) plane and the (210) plane, and a total of the (331) plane and the (210) plane are all within ±20%.
Inventors:
Takahiro Saito
Application Number:
JP2013522905A
Publication Date:
January 15, 2014
Filing Date:
June 27, 2012
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C25D1/04; H05K1/09
Domestic Patent References:
| JP200813847A |
Foreign References:
| WO2007105635A1 |
Attorney, Agent or Firm:
Takahisa Sato