Title:
樹脂金属接合物及びその製造方法
Document Type and Number:
Japanese Patent JP5391459
Kind Code:
B2
Abstract:
Disclosed is a resin-metal bonded article which is improved in adhesion between a copper component and a PPS or PBT resin. Also disclosed is a method for producing such a resin-metal bonded article. The resin-metal bonded article is obtained by bonding the resin component onto the surface of the copper component through a copper component bonding surface where there is copper oxide in the following range: 10 % ¦ Cu 2 O/(Cu 2 O + CuO) ¦ 75 %. Preferably, this resin-metal bonded article further contains a triazine thiol derivative in the resin-component-side bonding surface of the copper component.
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Inventors:
Kuroyama Masumi
Kato Kazuo
Tomonori Ishikawa
Yaeko Sasaki
Setsuko Sato
Masayuki Nakamura
Shuhei Miura
Kato Kazuo
Tomonori Ishikawa
Yaeko Sasaki
Setsuko Sato
Masayuki Nakamura
Shuhei Miura
Application Number:
JP2010278593A
Publication Date:
January 15, 2014
Filing Date:
November 29, 2010
Export Citation:
Assignee:
Toa Denka Co., Ltd.
International Classes:
B32B15/09; B29C45/14
Domestic Patent References:
| JP2000271957A | ||||
| JP11111908A | ||||
| JP2007050630A | ||||
| JP2001225352A | ||||
| JP2006027018A | ||||
| JP62259309A | ||||
| JP4334093A |
Attorney, Agent or Firm:
Junko Sugimura