Title:
表面処理銅箔
Document Type and Number:
Japanese Patent JP5400960
Kind Code:
B2
Abstract:
An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350°C to 400°C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc, and the either rust-proofing treatment layer is a zinc layer having zinc amount of 20 mg/m 2 to 1,000 mg/m 2 ; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.
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Inventors:
Shin-ichi Obata
Shinya Hiraoka
Thin 越 Fumiaki
Ayumi Tatsuoka
Hideaki Matsushima
Miyake Koichi
Sakiko Tomonaga
Tomoshi Maeda
Shinya Hiraoka
Thin 越 Fumiaki
Ayumi Tatsuoka
Hideaki Matsushima
Miyake Koichi
Sakiko Tomonaga
Tomoshi Maeda
Application Number:
JP2012515831A
Publication Date:
January 29, 2014
Filing Date:
November 22, 2011
Export Citation:
Assignee:
Mitsui Mining and Smelting Co., Ltd.
International Classes:
C25D7/06; C25D1/04
Domestic Patent References:
| JP2008101267A | 2008-05-01 | |||
| JP2009221592A | 2009-10-01 | |||
| JP2003201585A | 2003-07-18 | |||
| JP2006052441A | 2006-02-23 | |||
| JP2008101267A | 2008-05-01 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura