Title:
アルミニウム箔の製造方法
Document Type and Number:
Japanese Patent JP5403053
Kind Code:
B2
Abstract:
An obj ect of the present invention is to provide a method for producing a high-ductility, high-purity aluminum foil at a high film formation rate by electrolysis using a plating solution having a low chlorine concentration. A method for producing an aluminum foil of the present invention as a means for achieving the object is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution at least containing (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by a general formula: R 1 R 2 R 3 R 4 N·X (wherein R 1 to R 4 independently represent an alkyl group and X represents a counteranion for the quaternary ammonium cation), and then the film is removed from the substrate.
Inventors:
Atsushi Okamoto
Star Hiroyuki
Setsuo Ando
Star Hiroyuki
Setsuo Ando
Application Number:
JP2011520907A
Publication Date:
January 29, 2014
Filing Date:
June 28, 2010
Export Citation:
Assignee:
Hitachi Metals, Ltd.
International Classes:
C25D1/04; C25D1/00; C25D3/66; H01G11/28; H01G11/66; H01G11/68; H01G11/84; H01M4/66; H01G11/02; H01G11/04
Domestic Patent References:
| JPH01104792A | 1989-04-21 | |||
| JP2005108724A | 2005-04-21 | |||
| JP2007238980A | 2007-09-20 | |||
| JP2008195989A | 2008-08-28 | |||
| JP2010090414A | 2010-04-22 |
Foreign References:
| WO2010044305A1 | 2010-04-22 |
Attorney, Agent or Firm:
Yukifumi Tsujita
Shin-ichi Abe
Shin-ichi Abe