Title:
大気圧プラズマ処理装置
Document Type and Number:
Japanese Patent JP5406848
Kind Code:
B2
Abstract:
A plasma processing device can be cooled without increasing the thickness of its electrodes in order to improve the processing efficiency. A discharge space (1a) is formed between a first discharge surface (11) of a first electrode (10) and a second discharge surface (21) of a second electrode (20) of the plasma processing device (1). The processing surface (22) of the second electrode (20) is faces an object to be processed (9). The second electrode (20) is provided with a heat transfer means (30). The thermal conductivity of the heat transfer means (30) is higher than that of the second electrode (20), and heat is transferred from the inner part to the peripheral part of the second electrode (20) by the temperature difference between the inner part and the peripheral part of the second electrode (20). The heat transfer means (30) is preferably constructed using a heat pipe (31).
Inventors:
Hiroto Takeuchi
Application Number:
JP2010535652A
Publication Date:
February 05, 2014
Filing Date:
October 26, 2009
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H05H1/24; H01L21/205; H01L21/3065; H01L21/31
Domestic Patent References:
| JP2004006211A | 2004-01-08 | |||
| JPH0661184A | 1994-03-04 | |||
| JP2001308081A | 2001-11-02 | |||
| JPH01248623A | 1989-10-04 |
Attorney, Agent or Firm:
Noboru Watanabe
Harada Sanjugi
Harada Sanjugi