Title:
ワイヤハーネス用クリップおよびワイヤハーネス用クリップの車体取付方法
Document Type and Number:
Japanese Patent JP5408068
Kind Code:
B2
Abstract:
The present invention includes a C-type resin clip projecting from an exterior surface on a band tightener in a band-type wire harness mount or from a front surface on a middle portion of a substrate in a substrate-type wire harness mount, and a C-type metal clip having a length shorter than the C-type resin clip. The C-type metal clip is mounted between upper and lower tabs of the C-type resin clip. A pressing projection is provided on opposing interior surfaces of each of the upper and lower tabs of the C-type resin clip, and a press-down tab is provided on the upper and lower tabs of the C-type metal clip. When a bracket is pressed in between the upper and lower tabs of the C-type metal clip, the press-down tabs are lifted by the pressing projections and both the upper and lower surfaces of the bracket are pinched and held.
Inventors:
Yoshiteru Fujiwara
Application Number:
JP2010176787A
Publication Date:
February 05, 2014
Filing Date:
August 05, 2010
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS,LTD.
International Classes:
H02G3/30; B60R16/02; F16B2/08
Domestic Patent References:
| JP2000152467A | ||||
| JP34010664Y1 | ||||
| JP10331814A | ||||
| JP2009225616A | ||||
| JP2008259363A |
Attorney, Agent or Firm:
Kazumi Owada