Title:
ICパッケージ
Document Type and Number:
Japanese Patent JP5408253
Kind Code:
B2
Abstract:
An IC package which can avoid electromagnetic waves leaked from a side surface of the IC package includes: an electric circuit board on which an IC chip is mounted; a first conductive board arranged at a position facing the electric circuit board while the IC chip on the electric circuit board is sandwiched therebetween; and a magnetic body which is arranged on a surface of the first conductive board on a side facing the IC chip and which is arranged at least partially on end portions of the first conductive board.
Inventors:
Norio Masuda
Application Number:
JP2011519571A
Publication Date:
February 05, 2014
Filing Date:
June 17, 2010
Export Citation:
Assignee:
NEC
International Classes:
H01L23/28; H01L23/00; H05K9/00
Domestic Patent References:
| JP2010087058A | 2010-04-15 | |||
| JP2003335921A | 2003-11-28 | |||
| JP2001358493A | 2001-12-26 | |||
| JP2004221463A | 2004-08-05 | |||
| JP2007157891A | 2007-06-21 | |||
| JP2010087058A | 2010-04-15 |
Attorney, Agent or Firm:
Sumio Tanai
Ryuichiro Mori
Naoki Matsuo
Ryuichiro Mori
Naoki Matsuo