Title:
回路基板用樹脂組成物、プリプレグおよび積層板
Document Type and Number:
Japanese Patent JP5417714
Kind Code:
B2
More Like This:
Inventors:
Akihiko Tobizawa
Application Number:
JP2008035532A
Publication Date:
February 19, 2014
Filing Date:
February 18, 2008
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H05K1/03; C08F212/02; C08F222/40; C08F226/06; C08J5/24
Domestic Patent References:
| JP2007099893A | ||||
| JP64085959A | ||||
| JP64056643A |
Foreign References:
| WO1992021651A1 |