筐体、半導体製造装置および搬送ロボット

Title:

筐体、半導体製造装置および搬送ロボット

Document Type and Number:

Japanese Patent JP5418640

Kind Code:

B2

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Inventors:

Takehiro Umezaki
Katsuhiko Shimada
Hideo Yamamoto

Application Number:

JP2012136281A

Publication Date:

February 19, 2014

Filing Date:

June 15, 2012

Export Citation:

Assignee:

Yaskawa Electric Co., Ltd.

International Classes:

H01L21/677; B25J9/06

Domestic Patent References:

Attorney, Agent or Firm:

Hiroaki Sakai

Previous Patent: JPS5418639

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