Title:
亜大気圧下で冷却剤によりエレクトロニクスを冷却する方法及び装置
Document Type and Number:
Japanese Patent JP5422379
Kind Code:
B2
Abstract:
According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
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| WO/1996/029553 | COOLING SYSTEM FOR ELECTRONICS |
| WO/2021/255968 | HEAT CONDUCTION MEMBER |
| JP3061407 | [Name of device] Heat dissipation plate |
Inventors:
Rammel, Kellin, A
Wyatt, William, Gee
Weber, richard, em
Wyatt, William, Gee
Weber, richard, em
Application Number:
JP2009509578A
Publication Date:
February 19, 2014
Filing Date:
April 10, 2007
Export Citation:
Assignee:
RAYTHEON COMPANY
International Classes:
H01L23/427; F28D15/02
Domestic Patent References:
| JP11330330A | ||||
| JP60229353A | ||||
| JP444352A | ||||
| JP2003318342A | ||||
| JP2004190928A | ||||
| JP11163571A | ||||
| JP200651477A | ||||
| JP2002221398A |
Foreign References:
| US20050262861 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki