Title:
超音波溶接装置及びその方法
Document Type and Number:
Japanese Patent JP5437741
Kind Code:
B2
Abstract:
An ultrasonic welding apparatus 1 includes an anvil equipped with a terminal clamp 3 for disposing an electrical contact part 31 connected to an electronic device and a core wire weld part 32 which ranges to the electrical contact part 31 and stacks a core wire 21 constructed by bundling plural strands, and a chip 7 which is disposed in a position opposed to the anvil and mutually welds the core wire to the terminal clamp by applying ultrasonic vibration in a state of pinching the core wire 21 and the terminal clamp 3 between the anvil and the chip and pressurizing the core wire and the terminal clamp in a direction of approaching each other. The ultrasonic welding apparatus 1 includes a core wire protrusion prevention wall 5 which is disposed in a position close to a terminal of the core wire 21 and prevents the terminal of the core wire 21 from moving to a place overlapping with the electrical contact part 31.
Inventors:
Kentaro Onuma
Application Number:
JP2009192765A
Publication Date:
March 12, 2014
Filing Date:
August 24, 2009
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H01R43/02; H01R4/02
Domestic Patent References:
| JP62208579A | ||||
| JP10149843A | ||||
| JP2007012329A | ||||
| JP2004071480A |
Attorney, Agent or Firm:
Hideo Takino
Sadao Matsumura
Fumio Takino
Sadao Matsumura
Fumio Takino