Title:
抵抗層付銅箔、該銅箔の製造方法および積層基板
Document Type and Number:
Japanese Patent JP5448616
Kind Code:
B2
Abstract:
A copper foil with a resistance layer is provided, wherein the variation value is small when it is made into a resistance element, the adhesion with the resin substrate to be laminated with is able to be sufficiently maintained, which has an excellent characteristics as a resistance element for a rigid and a flexible substrate. A copper foil with a resistance layer of the present invention comprises a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles. A method of production of a copper foil with a resistance layer of the present invention comprises: forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.5 μm in terms of Rz value prescribed in JIS-B-0601; and performing roughening treatment to a surface of the resistance layer with nickel particles wherein a roughness is within a range of 4.5 to 8.5 μm in terms of Rz value prescribed in JIS-B-0601. The alloy layer is for example formed from phosphorus-containing nickel.
Inventors:
Ryoichi Oguro
Ka optical path
Kazuhiro Hoshino
Ka optical path
Kazuhiro Hoshino
Application Number:
JP2009165571A
Publication Date:
March 19, 2014
Filing Date:
July 14, 2009
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C25D7/06; C23C28/00; C25D5/14
Domestic Patent References:
| JP2004176101A | ||||
| JP2004169118A | ||||
| JP2008184633A |
Attorney, Agent or Firm:
Takahisa Sato