Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5458608
Kind Code:
B2
Inventors:
Masaaki Ogino
Yajima Riko
Akihiko Oi
Yajima Riko
Akihiko Oi
Application Number:
JP2009056698A
Publication Date:
April 02, 2014
Filing Date:
March 10, 2009
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L21/336; H01L21/3065; H01L29/78
Domestic Patent References:
| JP2002124474A | ||||
| JP2001345294A | ||||
| JP2001085387A | ||||
| JP2000183032A |
Attorney, Agent or Firm:
Akinori Sakai
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