Title:
微細回路の形成のためのエンベデッド用銅箔
Document Type and Number:
Japanese Patent JP5464722
Kind Code:
B2
Abstract:
Proposed is a copper foil for an embedded pattern, which has no nodule, and which comprises: a copper carrier layer; a barrier layer formed at one surface of the copper carrier layer; and a seed layer formed at a surface of the barrier layer to form a circuit. The barrier layer is a nickel layer or a nickel alloy layer, and the seed layer is a copper layer. The surface of the seed layer has an average roughness Rz of less than 1.5 µm, and Rmax of less than 2.5 µm.
Inventors:
Ryu Jong Ho
Yang Chang-yeol
Yang Chang-yeol
Application Number:
JP2012526669A
Publication Date:
April 09, 2014
Filing Date:
August 31, 2010
Export Citation:
Assignee:
Iljin Copper Wheel Company Limited
International Classes:
C25D7/06; C25D1/10; C25D3/38; C25D5/12; H05K3/20
Domestic Patent References:
| JP2004162172A |
Foreign References:
| WO2008126522A1 |
Other References:
福富直樹 他5名,特集 MCM/LSI実装技術 MCM/LSI実装用プリント配線板製造プロセス 転写法配線板 ,サーキット テクノロジ,日本,一般社団法人 エレクトロニクス実装学会,1994年 8月,Vol.9 No.5,Page.369-376
Attorney, Agent or Firm:
Masu Kobori
Takato Tsutsumi
Takato Tsutsumi