Title:
電気鋳造方法
Document Type and Number:
Japanese Patent JP5470791
Kind Code:
B2
Abstract:
A mold 11 is fabricated with a cavity 15 formed in an insulating layer 14 formed so as to be placed on an upper surface of a conductive base material 13. This mold 11 is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity 15 to electroform a metal-formed product 12 in the cavity 15. In this electrodepositing process, when the width of the cavity 15 is taken as W and a vertical height of a head space between an upper opening of the cavity 15 and an upper surface of a metal layer 18 is taken as H, the growth of the metal layer 18 is stopped so that the height H of the head space left above the metal layer 18 satisfies:
H ‰¥ W/2.85 where 300 µm ‰¤ W;
H ‰¥ W/3.75 where 200 µm ‰¤ W < 300 µm;
H ‰¥ W/4 where 100 µm ‰¤ W < 200 µm; and
H ‰¥ W/10 where W < 100 µm.
Inventors:
Toshimasa Seki
Akihiko Hatamura
Hitoshi Yoshida
Toshio Yamashita
Yasuhiro Miura
Akihiko Hatamura
Hitoshi Yoshida
Toshio Yamashita
Yasuhiro Miura
Application Number:
JP2008251085A
Publication Date:
April 16, 2014
Filing Date:
September 29, 2008
Export Citation:
Assignee:
OMRON Corporation
International Classes:
C25D1/10
Domestic Patent References:
JP8064145A | ||||
JP8138941A | ||||
JP2001205599A | ||||
JP3163857A | ||||
JP5259359A | ||||
JP4183892A |
Attorney, Agent or Firm:
Masafusa Nakano
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