Title:
半導体集積回路の製造方法
Document Type and Number:
Japanese Patent JP5475818
Kind Code:
B2
Inventors:
Yoshihisa Matsubara
Application Number:
JP2012055355A
Publication Date:
April 16, 2014
Filing Date:
March 13, 2012
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/027; G03F1/70; H01L21/82
Domestic Patent References:
| JP4287908A | ||||
| JP2000284494A | ||||
| JP6089839A | ||||
| JP6181164A | ||||
| JP1154519A | ||||
| JP2004079778A | ||||
| JP355554A | ||||
| JP2000208397A | ||||
| JP2003229433A | ||||
| JP2002229180A | ||||
| JP201066486A |
Attorney, Agent or Firm:
Shinji Hayami
Satoshi Amagi
Satoshi Amagi