Title:
積層セラミックシート切断用熱剥離型粘着シート及び積層セラミックシートの切断加工方法
Document Type and Number:
Japanese Patent JP5479151
Kind Code:
B2
Abstract:
The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive, a foaming agent and a tackifying resin, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the base polymer of the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer has an acid value of 350 mg-KOH/g or less and the tackifying resin contained in the heat-expandable pressure-sensitive adhesive layer has an acid value of 80 mg-KOH/g or less.
Inventors:
Yuichiro Yanagi
Daisuke Shimokawa
Yukio Arimitsu
Daisuke Shimokawa
Yukio Arimitsu
Application Number:
JP2010036010A
Publication Date:
April 23, 2014
Filing Date:
February 22, 2010
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
B28B11/14; C09J7/22; C09J7/38; C09J11/06; C09J133/04
Domestic Patent References:
| JP2003160765A | ||||
| JP2005281418A | ||||
| JP2003338678A | ||||
| JP2008195888A | ||||
| JP2006348143A | ||||
| JP63033487A |
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