Title:
アルミニウム構造体の製造方法およびアルミニウム構造体
Document Type and Number:
Japanese Patent JP5488996
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method that is capable of aluminum plating of a surface, even for a porous resin molded body having a three-dimensional mesh structure, to form a highly-pure aluminum structure by controlling a film thickness to be uniformized, and in particular; and to provide a method of obtaining a large-surface area aluminum porous body.SOLUTION: A method for manufacturing an aluminum structure, includes: a conductivity-imparting step for forming on a surface of a resin molded body a conductive layer comprising aluminum; and a plating step for plating the resin molded body imparted with conductivity in a molten salt bath with the aluminum.
Inventors:
Hosoe Akihisa
Koji Nitta
Tomoyuki Awazu
Kazuki Okuno
Koji Nitta
Tomoyuki Awazu
Kazuki Okuno
Application Number:
JP2010130607A
Publication Date:
May 14, 2014
Filing Date:
June 08, 2010
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
C25D1/08; C22C1/08; C22C21/00; C23C14/20; C25D5/56; C25D7/00; H01G11/66; H01G11/68; H01G11/70; H01G11/84; H01M4/66; H01M4/80
Domestic Patent References:
| JP5271986A | ||||
| JP8165590A | ||||
| JP6306672A | ||||
| JP6279609A | ||||
| JP62093058A | ||||
| JP61076686A | ||||
| JP2004509230A |
Attorney, Agent or Firm:
Hideaki Nishima
Takeshi Morita
Kosoegawa Misako
Toya Masahiro
Seiji Ogino
Akira Kawaguchi
Takeshi Morita
Kosoegawa Misako
Toya Masahiro
Seiji Ogino
Akira Kawaguchi