Title:
電子部品用樹脂付着防止剤、それを含む電子部材および電子部品
Document Type and Number:
Japanese Patent JP5491417
Kind Code:
B2
Inventors:
Ryo Hirabayashi
Fusae Ishiwata
Kunio Watanabe
Yoichi Amase
Yoichi Takagi
Fusae Ishiwata
Kunio Watanabe
Yoichi Amase
Yoichi Takagi
Application Number:
JP2010545700A
Publication Date:
May 14, 2014
Filing Date:
December 22, 2009
Export Citation:
Assignee:
AGC Seimi Chemical Co., Ltd.
International Classes:
C09K3/00
Domestic Patent References:
JPH03256310A | 1991-11-15 | |||
JPH10158462A | 1998-06-16 | |||
JPH01139667A | 1989-06-01 | |||
JPH08176496A | 1996-07-09 | |||
JPH0718247A | 1995-01-20 | |||
JPH0718243A | 1995-01-20 | |||
JPH0693212A | 1994-04-05 | |||
JPS6112777A | 1986-01-21 | |||
JPS619480A | 1986-01-17 | |||
JPS60262812A | 1985-12-26 | |||
JPH03256310A | 1991-11-15 | |||
JPH10158462A | 1998-06-16 | |||
JPH01139667A | 1989-06-01 | |||
JPH08176496A | 1996-07-09 | |||
JPH0718247A | 1995-01-20 | |||
JPH0718243A | 1995-01-20 | |||
JPH0693212A | 1994-04-05 | |||
JPS6112777A | 1986-01-21 | |||
JPS619480A | 1986-01-17 | |||
JPS60262812A | 1985-12-26 |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Haruko Sanwa
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