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Title:
電子部品用樹脂付着防止剤、それを含む電子部材および電子部品
Document Type and Number:
Japanese Patent JP5491417
Kind Code:
B2
Inventors:
Ryo Hirabayashi
Fusae Ishiwata
Kunio Watanabe
Yoichi Amase
Yoichi Takagi
Application Number:
JP2010545700A
Publication Date:
May 14, 2014
Filing Date:
December 22, 2009
Export Citation:
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Assignee:
AGC Seimi Chemical Co., Ltd.
International Classes:
C09K3/00
Domestic Patent References:
JPH03256310A1991-11-15
JPH10158462A1998-06-16
JPH01139667A1989-06-01
JPH08176496A1996-07-09
JPH0718247A1995-01-20
JPH0718243A1995-01-20
JPH0693212A1994-04-05
JPS6112777A1986-01-21
JPS619480A1986-01-17
JPS60262812A1985-12-26
JPH03256310A1991-11-15
JPH10158462A1998-06-16
JPH01139667A1989-06-01
JPH08176496A1996-07-09
JPH0718247A1995-01-20
JPH0718243A1995-01-20
JPH0693212A1994-04-05
JPS6112777A1986-01-21
JPS619480A1986-01-17
JPS60262812A1985-12-26
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa