Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5492487
Kind Code:
B2
Inventors:
Seiichiro Ihara
Toshihiro Ogata
Tomoaki Taira
Hironori Terasaki
Toshihiro Ogata
Tomoaki Taira
Hironori Terasaki
Application Number:
JP2009181214A
Publication Date:
May 14, 2014
Filing Date:
August 04, 2009
Export Citation:
Assignee:
New Japan Radio Co., Ltd.
International Classes:
H01L23/32; H01L21/56
Domestic Patent References:
| JP2005129617A | ||||
| JP2006339232A | ||||
| JP2006294670A |