Title:
発光装置
Document Type and Number:
Japanese Patent JP5492862
Kind Code:
B2
Abstract:
A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.
Inventors:
Shunpei Yamazaki
Kenji Fukunaga
Kenji Fukunaga
Application Number:
JP2011247238A
Publication Date:
May 14, 2014
Filing Date:
November 11, 2011
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
G09F9/30; H05B33/04; G01N33/497; G09F9/00; H01L27/32; H01L31/12; H01L51/50; H04N5/70; H05B33/02; H05B33/06; H05B33/14; H05B44/00
Domestic Patent References:
| JP9219288A | ||||
| JP10091095A | ||||
| JP7169567A | ||||
| JP2001236025A | ||||
| JP2001092385A | ||||
| JP1071899U | ||||
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