Title:
発光素子用回路基板及び発光装置並びにそれらの製造方法
Document Type and Number:
Japanese Patent JP5493389
Kind Code:
B2
More Like This:
Inventors:
Masashi Kuramoto
Application Number:
JP2009045005A
Publication Date:
May 14, 2014
Filing Date:
February 27, 2009
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/60
Domestic Patent References:
| JP2006156704A | ||||
| JP2007329219A | ||||
| JP2007157940A | ||||
| JP2005353914A | ||||
| JP2006147999A | ||||
| JP2006140207A | ||||
| JP2007129173A | ||||
| JP2010226095A | ||||
| JP2007329249A | ||||
| JP2003218399A | ||||
| JP2008300694A | ||||
| JP2008258296A | ||||
| JP2009176847A |
Foreign References:
| WO2007015426A1 | ||||
| WO2010038673A1 |
Other References:
浦崎直之 et al.,表面実装型LED用白色反射モールド材,日立化成テクニカルレポート,2008年 1月,第50号,p.7-10