Title:
BGAメッシュ・キャップを有するパッケージ・オン・パッケージ・セキュア・モジュール
Document Type and Number:
Japanese Patent JP5503526
Kind Code:
B2
Abstract:
A package-on-package (POP) secure module includes a BGA mesh cap, a first BGA package, and a second BGA package. The first BGA package includes a first integrated circuit (for example, a microcontroller that includes tamper detect logic). The second BGA package includes a second integrated circuit (for example, a memory). The second BGA package is piggy-back mounted to the first BGA package and the BGA mesh cap is piggy-back mounted to the second BGA package. A printed circuit board substrate member of the BGA mesh cap includes an embedded anti-tamper mesh. This mesh is connected in a protected manner within the module to the first integrated circuit. When the module is in use, a mesh embedded in an underlying printed circuit board is coupled to the BGA cap mesh so that both anti-tamper meshes are controlled by the tamper detect logic.
Inventors:
Eaton, David Di
Starve, David Earl
Zeta, Ruben Xii
Starve, David Earl
Zeta, Ruben Xii
Application Number:
JP2010502987A
Publication Date:
May 28, 2014
Filing Date:
August 10, 2007
Export Citation:
Assignee:
Maxim Integrated Products Incorporated
International Classes:
H01L25/10; H01L25/11; H01L25/18
Domestic Patent References:
| JP2001223297A | ||||
| JP2008537333A |
Foreign References:
| US20070018334 | ||||
| US20060231633 | ||||
| US6646565 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa