Title:
プラズマ処理装置
Document Type and Number:
Japanese Patent JP5503733
Kind Code:
B2
Abstract:
Disclosed is a plasma treatment device which, capable of preventing the condensation inside a nozzle, avoids malfunctions such as short circuits even if the reactive components of the reaction gas tend to condense. A discharge space (13) is formed between the electrodes of an electrode pair (11, 12) of a plasma treatment device (1), and a treated body (9) is irradiated with plasma. A nozzle (20) is disposed near at least one of the pair of electrodes (11, 12) or the discharge space (13). A reaction gas containing a condensing reactive component is sprayed from the nozzle (20) at the treated object (9). The temperature of the nozzle (20) is adjusted by means of a nozzle temperature adjustment means (30). A temperature adjustment path (32) is formed inside the nozzle (20) as the temperature adjustment means (30), and a temperature-regulating fluid is caused to flow through said temperature adjustment path (32). By means of a liquid temperature adjustment unit (31), the temperature-regulating fluid is adjusted so as to be at a temperature higher than the condensing temperature of the reactive component.
Inventors:
Shinichi Kawasaki
Mitsuhide Nogami
Yoshinori Nakano
Takashi Sato
Mitsuhide Nogami
Yoshinori Nakano
Takashi Sato
Application Number:
JP2012506932A
Publication Date:
May 28, 2014
Filing Date:
March 10, 2011
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08J7/00; C23C16/455
Domestic Patent References:
| JPH11329117A | 1999-11-30 | |||
| JP2005256160A | 2005-09-22 |
Foreign References:
| WO2009008284A1 | 2009-01-15 | |||
| WO2008029622A1 | 2008-03-13 |
Attorney, Agent or Firm:
Noboru Watanabe
Harada Sanjugi
Harada Sanjugi