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Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5507654
Kind Code:
B2
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Inventors:
Takuya Nise
Tobimatsu Hiroshi
Application Number:
JP2012262017A
Publication Date:
May 28, 2014
Filing Date:
November 30, 2012
Export Citation:
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Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/768; C23C14/02; C23C14/56; C23C16/02; C23C16/08; C23C16/34; H01L21/28; H01L21/304; H01L21/3065; H01L21/8238; H01L27/092
Domestic Patent References:
JP2005244244A
JP2001267536A
JP2004221155A
JP2001053055A
Foreign References:
WO2005098913A1
Attorney, Agent or Firm:
Yamato Tsutsui



 
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