Title:
リードフレーム
Document Type and Number:
Japanese Patent JP5508329
Kind Code:
B2
Abstract:
To provide a lead frame which suppresses occurrence of cracks when being bent and exhibits superior adhesion to a mold resin.
In a lead frame in which a noble metal-plated layer 13 is formed on the surface of a raw material metal 10 via an Ni-plated substrate layer, the surface roughness Ra of the Ni-plated substrate layer is within the range of 0.1 to 0.8 μm. The noble metal-plated layer 13 is formed on the surface of the Ni-plated substrate layer by a flash plating in conformity to the angular or aciculate rough profile of the surface of the Ni-plated substrate layer. In that regard, the noble metal of the plated layer 13 is at least one of Pd, Au and Ag.
COPYRIGHT: (C)2011,JPO&INPIT
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Inventors:
Li Ming
Yamaura Daigo
Yamaura Daigo
Application Number:
JP2011087575A
Publication Date:
May 28, 2014
Filing Date:
April 11, 2011
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
C25D5/12; C25D7/00; H01L23/50
Domestic Patent References:
| JP9298265A | ||||
| JP10265991A | ||||
| JP10068097A | ||||
| JP2000077594A | ||||
| JP10070224A | ||||
| JP2003309242A | ||||
| JP2002299538A |
Attorney, Agent or Firm:
Fujio Nakamae