Title:
傷跡および/またはケロイドの治療または防止のためのデバイスならびに包帯、ならびにそのための方法およびキット
Document Type and Number:
Japanese Patent JP5508851
Kind Code:
B2
Abstract:
Devices, bandages, kits and methods are described that can control or regulate the mechanical environment of a wound to ameliorate scar and/or keloid formation. The mechanical environment of a wound includes stress, strain, and any combination of stress and strain. The control of a wound's mechanical environment can be active, passive, dynamic, or static. The devices are configured to be removably secured to a skin surface in proximity to the wound site and shield the wound from endogenous and/or exogenous stress.
Inventors:
Gartner, Jeffrey Sea.
Dorskirt, Reinhold H.
Long Acres, Michael Tee.
Yock, Paul
Dorskirt, Reinhold H.
Long Acres, Michael Tee.
Yock, Paul
Application Number:
JP2009522879A
Publication Date:
June 04, 2014
Filing Date:
August 03, 2007
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
International Classes:
A61L15/16; A61B17/00; A61F13/00; A61F13/02; A61K38/16; A61K47/48; C07K5/06; C07K5/072; C07K5/083; C07K5/103; C07K7/02; C07K9/00; G01N33/574; C12N
Domestic Patent References:
| JP2004223087A | ||||
| JP2006513748A | ||||
| JP2004536898A |
Foreign References:
| WO2005079674A1 | ||||
| US4531521 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita