Title:
レーザ装置およびその製造方法
Document Type and Number:
Japanese Patent JP5509317
Kind Code:
B2
Abstract:
A laser device (100) of the present invention includes: a semiconductor laser element (2) having an output surface (2a) via which laser light is outputted; an optical fiber (4) having a leading end portion (4a) facing the output surface (2a) of the semiconductor laser element (2); and an optical fiber supporting member (5) for supporting the optical fiber (4), the optical fiber supporting member (5) being made from a non heat insulating material and having a bonding pad (7) to which the optical fiber (4) is fixed by use of solder (8). The optical fiber supporting member (5) includes a contact portion thermally in contact with a base (1). The bonding pad (7) is (i) spaced apart from the contact portion so as to be located on a side opposite from the contact portion so that a region to which laser light is applied from another laser element when the optical fiber (4) is fixed to the bonding pad (7) is sandwiched between the bonding pad (7) and the base (1) and (ii) separated spatially from the base (1).
Inventors:
Toyohara Nozomi
Akira Sakamoto
Youhei Kasai
Akira Sakamoto
Youhei Kasai
Application Number:
JP2012508245A
Publication Date:
June 04, 2014
Filing Date:
March 24, 2011
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
G02B6/42
Domestic Patent References:
| JPH01306804A | 1989-12-11 | |||
| JPH01225909A | 1989-09-08 | |||
| JPH01225910A | 1989-09-08 | |||
| JPH01229208A | 1989-09-12 | |||
| JPH02308108A | 1990-12-21 | |||
| JPH01270012A | 1989-10-27 | |||
| JPH01310318A | 1989-12-14 | |||
| JPS61224471A | 1986-10-06 | |||
| JPS57138191A | 1982-08-26 | |||
| JP2007258480A | 2007-10-04 | |||
| JP2007258479A | 2007-10-04 | |||
| JP2007256665A | 2007-10-04 | |||
| JP2007149932A | 2007-06-14 | |||
| JPH01177713U | 1989-12-19 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark